During preparations for a hardware project a new part needed to be added to our library: The Xmega A3 is available in the same SMD packages as its predecessor, the Mega128. However, it features a DMA Controller and an Event System - short: a well increased performance. Find out for yourself…below you can download the library including the 64-lead TQFP and MLF package for the Eagle PCB layout software.

xmega_a3.lbr

P.S.: The pinning was derived from the preliminary documentation available 08/08.

After getting an electronic circuit flashing a LED, the next task was to figure out how to enable automated structuring of the economically - and by the way also very ecologically - coated surface of that piece of cardboard. The structuring is needed to provide mutually isolated areas and tracks which will serve as the basis for subsequently mounted circuitry. Also, it seemed necessary to us to evaluate the usability of this cheap process in mass production scenarios this way. However, with the help of Michael Reuter, Semiconductors Engineer, we found a laser configuration which cuts through the conductive zinc layer, but not through the supporting cardboard. But see for yourself:

Here you can look at the structured cardboard’s back side.

Blogging - at last:

sipwerk presents the first SMD circuit on a structured zinc surface:

First, a everyday business card cardboard was coated with zinc by a thermal spraying process. Second step was a manual structuring of the surface. Finally a surface mounted NE555 integrated timer chip and it’s associating discrete circuitry was soldered onto the conducting structure. The whole arrangement is blinking a red LED.

You can watch it blink here (HighRes).